| 摘要 |
An inkjet printhead fabricated on a wafer substrate. The wafer has a drop ejection side and a liquid supply side with a plurality of nozzles, drop ejection actuators corresponding to each nozzle respectively and drive circuitry deposited in CMOS layers formed on the drop ejection side of the wafer. Liquid passages extend between the liquid supply side and the drop ejection side to supply the nozzles with liquid. The liquid passages extend through the CMOS layers less than 20 microns away from the drive circuitry. This improves the nozzle packing density of the printhead to enhance print quality.
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