发明名称 |
Heat dissipation device and composite material with high thermal conductivity |
摘要 |
A heat dissipation device for an electronic device includes a first heat dissipation element contacting the electronic device, wherein the material of the first heat dissipation element includes a composite material with high thermal conductivity comprising carbon fiber or porous graphite. The material with high thermal conductivity includes a fibrous structure and a matrix.
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申请公布号 |
US2007053166(A1) |
申请公布日期 |
2007.03.08 |
申请号 |
US20060453416 |
申请日期 |
2006.06.14 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HWANG JEN-DONG;SU JIANN-JONG;CHANG CHIH-JONG;WONG CHENG-CHOU |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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