| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a projecting and recessed multilayer circuit board module which can be processed inexpensively into a high strength three-dimensional molding while enhancing the high precision of a circuit used in the recess, and applicable to wide use because a component can be mounted both on the protrusion and in the recess. <P>SOLUTION: A resin protrusion 2 is formed on at least one surface of a multilayer circuit board 1, and a recess 3 is formed in a portion of the multilayer circuit board 1 other than the protrusion 2. A circuit 5 ensuring conduction with the circuit 4 of the multilayer circuit board 1 is formed on the protrusion 2. Circuits other than the circuit 5 formed on the protrusion 2 are formed by exposing the surface layer circuit 4 of the multilayer circuit board 1, and a component 6 is mounted in the recess 3. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
