PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLY

摘要

Disclosed are methods and devices for providing improved semiconductor packages and package-on-package (POP) integrated circuit (IC) assemblies using the improved packages with reduced warping. According to disclosed embodiments of the inventions, a packaged semiconductor device for use in a POP assembly includes an encapsulated region generally defined by the substrate surface (18). The encapsulant (26) is provided with contact apertures (30) permitting external communication with contacts on the substrate and coupled to an encapsulated chip. Preferred embodiments of, the invention are described in which the contact aperture sidewalls are angled within the range of approximately 10-30 degrees or more from vertical and in which the contact aperture is provided a gas release channel to permit gas to escape during reflow.