| 发明名称 |
POLYIMIDE PRECURSOR COMPOSITION, METHOD FOR PRODUCING POLYIMIDE FILM AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide precursor composition or the like which can be suitably used for producing a polyimide film by a low-temperature process, regardless of the skeleton structure of the polyimide precursor and has high storage stability. <P>SOLUTION: The polyimide precursor composition, for example, for forming a polyimide pattern on a substrate comprises (a) a polyimide acid, (b) a thermal base generator which is a neutral compound which generates a secondary amine undergoing thermal decomposition when heated at a temperature of ≤200°C and (c) a solvent. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007056196(A) |
申请公布日期 |
2007.03.08 |
| 申请号 |
JP20050245463 |
申请日期 |
2005.08.26 |
| 申请人 |
TOKYO INSTITUTE OF TECHNOLOGY;ASAHI KASEI ELECTRONICS CO LTD |
发明人 |
UEDA MITSURU;FUKUKAWA KENICHI;OGURA TOMOSHI;DOI ICHIRO;HANABATAKE HIROYUKI |
| 分类号 |
C08G73/10;G03F7/004;G03F7/037;G03F7/038;H01L21/027 |
主分类号 |
C08G73/10 |
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