| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate with electronic component mounted thereon employing underfill material and the manufacturing method of the same which permits the improvement of a mounting density much more, without necessitating the use of physical suppressing means for the outflow of the underfill material such as groove, frame or a surface treatment region. <P>SOLUTION: The substrate 1 comprises a substrate main body 3, and an electronic component 5 mounted under a state that the same is connected electrically to a substrate main body 3, while the underfill material 19 is filled in between the substrate main body 3 and a surface electrically connected to the substrate main body of the electronic component 5. In this case, holes 21 for electrically connecting to other components are provided so as to penetrate the layer 19a of underfill material which flows out to outside from the connecting region of the electronic component 5 and the substrate main body 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
