| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide packaging for a high-speed integrated circuit for preventing pair coupling generated between differential signals in a high-speed integrated circuit for performing differential signal transmission. <P>SOLUTION: An integrated circuit package is provided with an integrated circuit die 611 provided with low-speed differential signal pads 614-1 to 4 and high-speed differential signal pads 614-5A, 5B and 614-6A, 6B. A lead frame 612 is provided with low-speed signal transmission leads 620-1 to 4 and differential signal leads 620-5A, 5B and 620-6A, 6B. The distance between a pair of the high-speed leads and the distance between each of pairs are different from a distance d1 being the distance between the low-speed leads 620-1 to 4, and the high-speed leads are arranged with irregular distances. <P>COPYRIGHT: (C)2007,JPO&INPIT |
