发明名称 CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a circuit module which prevents certainly that a cooling medium adheres to the connective material which connects mutually the electric circuits allocated in two or more case members. SOLUTION: A through-hole 31 is bored in a laminated state where an upper side case member 3 having an electric circuit and a lower side case member 5 are brought into contact, and the connective material is allocated in this through-hole 31. The circuit module wherein a channel for cooling media is also formed and a cooling medium is circulated to this channel for cooling media is provided with a sealing member 45 in the periphery of the through-hole 31. Further, in the perimeter side of this sealing member 45, a discharge groove 49 is formed for discharging a cooling medium which infiltrates between both the case members 3 and 5 to the exterior of the case members 3 and 5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007059602(A) 申请公布日期 2007.03.08
申请号 JP20050242732 申请日期 2005.08.24
申请人 NISSAN MOTOR CO LTD 发明人 ONO KOYO;SHIBUYA AKIHIRO;FURUKAWA SUKEYUKI;NARUSE MIKIO
分类号 H05K7/20;H01L25/07;H01L25/18 主分类号 H05K7/20
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