发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device includes a first insulating layer, which is formed on a semiconductor substrate (not shown), and formed with a concave portion, and an electric fuse which has a conductive member, a first terminal provided on one end and a second terminal provided on the other end of the conductive member, and which is provided on the first insulating layer. The first insulating layer is embedded with the conductive member. The conductive member has a flowing-out region in which a material forming the conductive member flows out to the outside of the concave portion, and is cut at a location different from the flowing-out region.
申请公布号 US2007052515(A1) 申请公布日期 2007.03.08
申请号 US20060514144 申请日期 2006.09.01
申请人 NEC ELECTRONICS CORPORATION 发明人 UEDA TAKEHIRO
分类号 H01H85/08 主分类号 H01H85/08
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