发明名称 |
Verfahren zur flip-chip-Montage von Halbleitervorrichtungen mit Klebstoffen |
摘要 |
The present invention is related to a flip-chip-on-board (FCOB) assembly technology applicable for mounting large chips with high I/O count or small pitch, mounted on low-cost or low-grade substrates. The assembly technology uses both an isotropically conductive adhesive (ICA) and a non-conductive material (NCA) in the same assembly cycle. The thermocompression step establishes at the same time the electrical and mechanical interconnections and the curing of the adhesives <IMAGE> |
申请公布号 |
DE60125999(D1) |
申请公布日期 |
2007.03.08 |
申请号 |
DE2001625999 |
申请日期 |
2001.02.09 |
申请人 |
INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM;UNIVERSITY OF GHENT |
发明人 |
VANFLETEREN, JAN;STOUKACH, SERGEI;VANDECASTEELE, BJORN |
分类号 |
H01L21/60;H01R43/20;H01L21/56;H05K3/32;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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