发明名称 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a cured product excellent in properties such as resolution, thermal shock resistance, curing shrinkage ratio and water absorption, and a positive photosensitive insulating resin composition capable of giving the cured product. <P>SOLUTION: The positive photosensitive insulating resin composition contains an alkali-soluble resin (A) having a constitutional unit represented by formula (1), a compound (B) having a quinonediazido group, a compound (C) having a functional group capable of reacting with the alkali-soluble resin (A), and a solvent (D), wherein R represents a 1-4C alkyl group, a 1-4C alkoxy group, a halogen atom or a hydroxyl group; and m is 0-3. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007057595(A) 申请公布日期 2007.03.08
申请号 JP20050240038 申请日期 2005.08.22
申请人 JSR CORP 发明人 INOMATA KATSUMI;ITO JUNJI;YOKOYAMA KENICHI;GOTO HIROFUMI;IWANAGA SHINICHIRO
分类号 G03F7/023;G03F7/004;H01L21/027 主分类号 G03F7/023
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