| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the mutual side slips of junction members in the case of a bump contact in a manufacturing method for a bump junction joining the two junction members through a bump. <P>SOLUTION: In the manufacturing method for the bump junctions, a plurality of the bumps 21 and 22 are formed to one surface 11a of a first junction member 11 and one surface 12a of a second junction member 12 oppositely faced to one surface 11a respectively, and the front end faces 21a and 22a of the bumps 21 and 22 for each junction member 11 and 12 are brought into contact and connected electrically. In the manufacturing method for the bump junctions, the front end faces 21a and 22a of each bump 21 and 22 are formed in inclined planes which are inclined towards the gravities G of the places of the arrays and in which the directions of the inclinations are equalized towards the gravities G among each bump 21 and 22, in at least one bump group in the first junction member 11 and the second junction member 12. In the manufacturing method, the front end faces 21a and 22a of both bumps 21 and 22 are brought into contact. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
