发明名称 MANUFACTURING METHOD FOR HIGH-FLEXIBLE COPPER CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To stably manufacture a flexible copper clad laminate comprising a copper foil of superior flexibility and a polyimide resin layer. SOLUTION: In a method for manufacturing a copper clad laminate comprising the copper foil and the polyimide resin layer by applying a polyimide precursor resin solution to the surface of the copper foil and then drying and hardening in a following heat treatment process, by maintaining 5-40 minutes in the temperature range of 300-450°C in the heat treatment process by using an electrolytic copper foil as the copper foil, the average crystal grain diameter of the copper foil is grown up 2-8 times of the average before the heat treatment process. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007059892(A) 申请公布日期 2007.03.08
申请号 JP20060202485 申请日期 2006.07.25
申请人 NIPPON STEEL CHEM CO LTD 发明人 FUKUDA NATSUKI;HATTORI KOICHI
分类号 H05K1/09;B05D7/14;B05D7/24;B32B15/088;H05K1/03 主分类号 H05K1/09
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