| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet-like heat dissipation member which has a good thermal conductivity/adhesiveness and is excellent in heat dissipation performance since the thermal resistance is remarkably low. SOLUTION: The sheet-like heat dissipation member, which is arranged among an electronic part and heat dissipation components generating heat during performance, which is non-mobile at room temperature, and which is filled up in an air gap in a border of the electronic part and the heat dissipation components by fluidizing it with the generated heat during the electronic part performance or positively applied during electronic part arrangement, contains (A) a silicone resin of 100 parts by volume and (B) a thermally conductive powder of 200 to 500 parts by volume. The (B) component has a mean particle diameter of 5.0-15.0μm, an oxygen content of below 0.1 mass%, a plus sieve molar fraction of 32μm of sieve opening of provision to JIS Z 8801-1 is 100 ppm or less, and is made of a thermosoftening thermal conductive composition comprising a thermosoftening thermal conductive copper powder of 50-100 vol.% which does not contain substantially sieve fraction of 45μm of sieve opening of the above standard. COPYRIGHT: (C)2007,JPO&INPIT
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