| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive insulating resin composition suitable for applications for interlayer insulating films, surface-protecting films or the like for semiconductor elements. SOLUTION: The photosensitive insulating resin composition comprises (A) a copolymer comprising a constitutional unit represented by formula (1) and a constitutional unit represented by formula (2), (B) a compound (B1) bearing an alkyl-etherified amino group and/or a compound (B2) bearing an epoxy group, (C) a photosensitive acid generating agent, (D) a solvent, (E) an auxiliary adhesive and (F) a crosslinked fine particle. COPYRIGHT: (C)2007,JPO&INPIT
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