| 摘要 |
A carrier-free semiconductor package with a stand-off member and a fabrication method thereof are proposed. A carrier with a recessed portion and a plurality of electrical contacts on a surface of the carrier is provided. At least one chip is mounted to the recessed portion of the carrier and is electrically connected to the electrical contacts. An encapsulant is formed on the carrier, for encapsulating the recessed portion, the chip, and the electrical contacts. Finally, the carrier is removed such that the semiconductor package with the stand-off member protruded from a bottom surface thereof is formed. The stand-off member is used for maintaining a predetermined mounting distance between the semiconductor package and an external device, such that problems in the prior art such as reduced fatigue lifetime and cracks of solder joints due to concentration of thermal stress on the solder joints can be overcome in the present invention.
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