发明名称 |
Adhesive film having multiple filler distribution and method of manufacturing the same, and chip stack package having the adhesive film and method of manufacturing the same |
摘要 |
Disclosed herein are an adhesive film having a multiple filler distribution and a method of manufacturing the same, and a chip stack package having the adhesive film and a method of manufacturing the same. The adhesive film may have an upper film layer with a high concentration of fillers with a small particle size, and a lower film layer with a low concentration of fillers of a large particle size. The adhesive film having a multiple filler distribution may be manufactured using a lamination method or a consecutive coating method. The adhesive film may include two film layers having identical chemical properties while having different physical properties.
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申请公布号 |
US2007052089(A1) |
申请公布日期 |
2007.03.08 |
申请号 |
US20060366456 |
申请日期 |
2006.03.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM WON-KEUN;PARK TAE-SUNG |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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