发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 <p>A semiconductor device is provided with a groove section (11) formed on a semiconductor substrate (10); first ONO films (18) arranged on both side planes of the groove section (11); and first word lines (22) arranged on side planes of the first ONO films (18) and extend in the longitudinal direction of the groove section (11). A method for manufacturing such semiconductor device is also provided. By the semiconductor device and the method for manufacturing the same, high storage capacity can be achieved.</p>
申请公布号 WO2007026494(A1) 申请公布日期 2007.03.08
申请号 WO2006JP315099 申请日期 2006.07.31
申请人 SPANSION JAPAN LIMITED;SPANSION LLC;HOSAKA, MASAYA;OKANISHI, MASATOMI;HEO, NAMJIN 发明人 HOSAKA, MASAYA;OKANISHI, MASATOMI;HEO, NAMJIN
分类号 H01L27/115;H01L21/8247;H01L29/788;H01L29/792 主分类号 H01L27/115
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