SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要
<p>A semiconductor device is provided with a groove section (11) formed on a semiconductor substrate (10); first ONO films (18) arranged on both side planes of the groove section (11); and first word lines (22) arranged on side planes of the first ONO films (18) and extend in the longitudinal direction of the groove section (11). A method for manufacturing such semiconductor device is also provided. By the semiconductor device and the method for manufacturing the same, high storage capacity can be achieved.</p>
申请公布号
WO2007026494(A1)
申请公布日期
2007.03.08
申请号
WO2006JP315099
申请日期
2006.07.31
申请人
SPANSION JAPAN LIMITED;SPANSION LLC;HOSAKA, MASAYA;OKANISHI, MASATOMI;HEO, NAMJIN