METHOD FOR BONDING BETWEEN ELECTRICAL DEVICES USING ULTRASONICATION

摘要

A method for bonding electrical devices to each other is provided to improve the yield and productivity and to enhance reliability of a bonding process by using ultrasonic waves capable of hardening an adhesive. First and second connection electrodes of electrical devices are arranged with each other. An adhesive is interposed between the first and second connection electrodes of the electrical devices. The adhesive is hardened by using an exothermic reaction of the adhesive itself. At this time, the exothermic reaction of the adhesive is caused by ultrasonic waves. A conductive adhesive or a non-conducting adhesive is used as the adhesive.