FILM LIKE ADHESIVE FOR ATTACHING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

摘要

A film like adhesive for attaching a semiconductor element, a semiconductor device using the same, and a method for manufacturing the semiconductor device are provided to prevent the generation of voids enough and to attach effectively the semiconductor element onto a substrate with a convexo-concave portion by using a relatively large thickness of the film like adhesive itself compared to that of an electronic part. A film like adhesive(10) for attaching a semiconductor element is composed of a plurality of adhesive films(20) stacked with each other. The adhesive film is made of a predetermined material with a melting viscosity of 50 PaÀs or less at a temperature of 140 ‹C. The thickness of the film like adhesive is in a range of 200 to 2000 micro meters.