| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit wiring board constructed symmetrically in a thicknes direction with an occurrence of its warpage extremely suppressed, and to provide its manufacturing method. SOLUTION: The circuit wiring board comprises a first and a second insulating substrates 2, 12 respectively laminated on both sides of a first filmy adhesion layer 4; a first and a second wiring layers 3, 13 respectively placed on each surface opposite to the first adhesion layer of the first and the second insulating substrates; a first and a second contact parts c1, c2 respectively placed at each facing part of the first and the second wiring layers; a through-hole H1 passing through the firt and the second insulating substrate and the first adhesion layer between the first and the second contact parts with each other; and a first interlayer conductive member 5 placed in the through-hole and connecting the contact parts with each other. The through-hole has a third hole h3 which diameter is larger than that of a first hole h1 and a second hole h2 respectively passing through the first insulating substrate, the first adhesion layer, and the second insulating substrate. COPYRIGHT: (C)2007,JPO&INPIT |
