| 摘要 |
A semiconductor package 100 is constructed of a semiconductor chip 110 , a sealing resin 106 for sealing this semiconductor chip 110 , and wiring 105 formed inside the sealing resin 106 . And, the wiring 105 is constructed of pattern wiring 105 b connected to the semiconductor chip 110 and also formed so as to be exposed to a lower surface 106 b of the sealing resin 106 , and a post part 105 a formed so as to extend in a thickness direction of the sealing resin 106 , the post part in which one end is connected to the pattern wiring 105 b and also the other end is formed so as to be exposed to an upper surface 106 a of the sealing resin 106.
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