| 摘要 |
A semiconductor chip 23 is mounted on an island section 22 in a lead frame composed of a lead having the island section 22 , a ground-bonding lead section 28 and a lead 21 a each continuing in sequence, and other lead terminal sections 21 b to 21 d, and then a grounding electrode 24 a and other electrodes 24 b to 24 d for the semiconductor chip are respectively wire-bonded to the lead 21 a and other lead terminals 21 b to 21 d by gold wires 25 a to 25 d before being embedded in a resin to form a package 27 . The lead with the semiconductor chip 23 mounted thereon is structured so that the ground-bonding lead section 28 continuing to both the lead 21 a and the island section 22 are absent on both the sides of the wire-bonding region 28 a with respect to the island section 22 in the longitudinal section along the grounded gold wire 25 a.
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