| 摘要 |
A semiconductor package for an image sensor and its manufacturing method are provided to improve the yield of products by preventing particles from being attached to a microlens using a protection cap made of a light transmitting material. A semiconductor package for an image sensor includes an image sensor chip(110) with a microlens, a protection cap, a substrate, a wire, and a transparent glass lid. The protection cap(120) is installed on the microlens of the image sensor chip to prevent particles from being attached to the microlens. The protection cap is made of a light transmitting material. The substrate(130) has a circuit pattern for mounting the image sensor chip. The wire(140) is used for connecting electrically the substrate with the image sensor chip. The transparent glass lid(150) is installed on the resultant structure to seal an upper portion of the substrate.
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