| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode device capable of preventing or reducing deformations, such as warpage of a resin layer, and making the amount of heat radiation increase. <P>SOLUTION: The light-emitting diode device comprises a substrate 2; the resin layer that is provided on the substrate, while a plurality of recesses 8, having a light projection opening 8b whose inner surface has reflection operation, are formed; a circuit pattern 5 arranged on the substrate that opposes the light projection opening; a light-emitting diode chip 6 that is arranged in each recess and is electrically connected to the circuit pattern; and a slit 11, that cuts out one portion of the outer surface of the resin layer and exposes one portion of the substrate to the outside. <P>COPYRIGHT: (C)2007,JPO&INPIT |
