| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent adhesion of a weight part to a cover plate due to electrostatic force when anode bonding for attaching the cover plate to a support part, and to facilitate its removal even in the case of adhesion, in a semiconductor sensor having the weight part for facilitating flexure of a flexible part on which a piezoelectric resistor is formed. <P>SOLUTION: The semiconductor sensor 1 is provided with: the weight part 4; the support part 6 provided around the weight part 4; the flexible part 8 provided on one surface side of the support part 6 between the weight part 4 and the support part 6; the piezoelectric resistor 10 provided on the flexible part 8; the cover plate 24 provided on the weight part 4 and the flexible part 8 with intervals from the weight part 4 and the flexible part 8; and a protruded part 22 provided on the surface where the cover plate 24 of the weight part 4 is provided and preventing the adhesion of the weight part 4 to the cover plate 24. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
