| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a suspension substrate equipped with a circuit capable of reducing manufacturing cost by forming a ground terminal for ground connection while reducing man-hour and time and labor. SOLUTION: A base insulating layer 3 is formed on a metal support substrate 2 so that a base opening 13 is formed, a conductor pattern 4 comprised of ground wiring 14 and a signal wiring pattern 15 is formed on the base insulating layer 3 and a cover insulating layer 5 which covers the conductor pattern 4 is formed on the base insulating layer 3 so that a first cover opening 16 and a second cover opening 17 are formed. After that, power is supplied from the ground wiring 14, electrolytic plated layers 6 are formed on the surface of the ground terminal 18 exposed from the first opening 16 and on the surface of a ground connection part 19 exposed from the second cover opening 17 and after that, a metal filled layer 7 is formed in the base opening 13 so that the ground connection part 19 and the metal support substrate 2 are conducted to each other. COPYRIGHT: (C)2007,JPO&INPIT |
