Flat panel display device and method of correcting bonding misalignment of driver IC and flat panel display

摘要

A method of correcting bonding misalignment between flat display panel and driver IC is provided. First, the contact pads of the bonding flat display panel and the bumps of the driver IC are bonded, wherein the flat display panel further includes a plurality of alignment marks around each contact pad. A bonding misalignment variation between the flat display panel and the driver IC may be identified by matching the position of the alignment mark and the position of the corresponding bump. Thereafter, a correction may be performed according to the bonding misalignment variation.