| 摘要 |
A heat-dissipating device with a base and multiple fins is described. The base has multiple grooves formed periodically thereon. Each of the fins has an end formed with a folded portion. The ends with the folded portions are thicker than the fins themselves and fixed within the grooves of the base. The fins can be made thinner than conventional ones. Hence, the number of the fins of the heat-dissipating device can be increased to enhance the heat-dissipating efficiency thereof. Furthermore, the grooves of the present invention can be made wider, so the manufacture of the present invention is easy and the overall cost is low.
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