INTERCONNECTING SUBSTRATES FOR MICROELECTRONIC DIES, METHODS FOR FORMING VIAS IN SUCH SUBSTRATES, AND METHODS FOR PACKAGING MICROELECTRONIC DEVICES
摘要
Substrates for mounting microelectronic dies, methods for forming vias in such -substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace (326 d) on a first side of a sheet of non-conductive material (323) , and forming a via (360 a) through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. hi one embodiment, forming the edge across the via exposes at least a portion of the conductive trace for subsequent attachment to a terminal (434) on a microelectronic die (430) .