发明名称 RELAY DEVICE USING CONDUCTIVE FLUID
摘要 <p>A relay device using a conductive fluid and having an excellent switching response is provided. The relay device is formed by bonding a semiconductor substrate to an insulator substrate, and mainly comprises a stacked layer body having an interior space, at least two contact points exposed to the interior space, a diaphragm portion facing the interior space, conductive fluid sealed in the interior space, and an actuator for elastically deforming the diaphragm portion. The diaphragm portion is provided on the semiconductor substrate, so that the drive force of the actuator necessary for elastically deforming the diaphragm portion can be reduced and the volume change of the interior space can be obtained with a fast response. This volume change causes the positional displacement of the conductive fluid in the interior space, thereby forming a conduction state or non-conduction state between the contact points.</p>
申请公布号 WO2007026678(A1) 申请公布日期 2007.03.08
申请号 WO2006JP316946 申请日期 2006.08.29
申请人 MATSUSHITA ELECTRIC WORKS, LTD.;YOKOYAMA, KOJI;UOTOME, RIICHI;FURUKUBO, EIICHI;KAKIMOTO, KATSUMI;MESHII, RYOSUKE;UEDA, HIDEKI;KOBAYASHI, MASAKAZU 发明人 YOKOYAMA, KOJI;UOTOME, RIICHI;FURUKUBO, EIICHI;KAKIMOTO, KATSUMI;MESHII, RYOSUKE;UEDA, HIDEKI;KOBAYASHI, MASAKAZU
分类号 H01H57/00;H01H29/02 主分类号 H01H57/00
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