WAFER ASSEMBLING APPARATUS AND METHOD

摘要

An apparatus and a method for assembling substrates are provided to reduce a time required to make atmospheric pressure into a high-degree vacuum state and bond substrates to each other with high accuracy in the vacuum state. An apparatus(1) for assembling substrates includes a first chamber(C1), a second chamber(C2), and a third chamber(C3). Two substrates are loaded into the first chamber. The two substrates are bonded to each other in the second chamber. The bonded substrates are unloaded from the third chamber. The inner pressure states of the first chamber and the third chamber are controlled to become an intermediate vacuum state in which the two substrates are bonded to each other. The inner pressure state of the second chamber is controlled to be a high vacuum state from the intermediate vacuum state.