| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a silicon based condenser microphone for increasing bonding strength between a board on which an MEMS microphone chip is installed, and metal, and a packaging method for the silicon base condenser microphone. <P>SOLUTION: A silicon based condenser microphone comprises: a metal case 110; and a board 120 which is mounted with a MEMS (Micro Electro Mechanical System) microphone chip 10 and an ASIC (Application Specific Integrated Circuit) chip 20 having an electric voltage pump 22 and a buffer IC 24 and is formed with a connecting pattern 121, on its surface, for bonding with the metal case, wherein the connecting pattern is welded to the metal case. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
