QUINOLINOLS AS FLUXING AND PROMOTER FOR UNDERFILL COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a composition containing a quinolinol compound as a fluxing agent and/or a promoter, especially a composition useful as an underfill composition for electronic packaging wherein the solder connection is used for the electrical connection. SOLUTION: The underfill composition contains quinolinol or a quinolinol derivative expressed by formula (1) as a fluxing agent and/or a promoter. The composition is sufficiently acidic to rightly function as a flux but not so acidic to cause early gelling or corrosion. The composition has a Tg value higher than that of a similar composition free from quinolinol or quinolinol derivative. COPYRIGHT: (C)2007,JPO&INPIT