| 摘要 |
PROBLEM TO BE SOLVED: To make a package thin, while securing a connection reliability at mounting of components on a wiring board by flip-chip bonding. SOLUTION: A pad of a semiconductor chip 1, whereon a bump is formed, is a small pad 3 with a narrow area. After mounting the semiconductor chip 1 on a substrate 2 with a large pad 4 having an area larger than the small pad 3, the bump formed on the small pad becomes a shape so as to be wetted and spread on the large pad 4, that is, the pitch in the gradient of the slope face of a circular truncated cone is made to become gentle gradually. COPYRIGHT: (C)2007,JPO&INPIT
|
