| 摘要 |
A fastening device for fastening a small component, in particular a stud provided with an adhesive flange, to a mounting surface using a heat-activated adhesive that creates an adhesive bond between the component and the mounting surface, has an induction coil to heat the component and/or the adhesive and a holding mechanism which holds the component while the fastening device moves to the bonding position. On the side facing the mounting surface is a bearing surface for the component toward which the component can be brought from outside. The holding device can be advanced to the component by the induction coil and has an electromagnet for generating a holding force that is directed toward the bearing surface.
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