| 摘要 |
<p>This invention provides a method for organic material layer formation that can realize the formation of an ultrafine pattern while maintaining electric characteristics of an organic material layer, comprising the steps of forming, on a substrate, a resist of an inversion pattern of an organic material layer pattern to be formed, subjecting the substrate surface in its part exposed from the resist to surface treatment for enhancing the adhesion to an organic material, forming an organic material layer on the resist and the exposed part, and selectively dissolving the resist with an aqueous solution which causes a selection ratio between the organic material and the resist to lift-off the organic material layer, on the resist, together with the resist.</p> |
