| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent defective bonding of an electrode of a light emitting diode chip and a bump of a mounting substrate. <P>SOLUTION: The electrode of a light emitting diode chip 1 is bonded to a bump 4 provided on the bottom of a recess 2a of a mounting substrate 2 by flip chip. If the electrode is contaminated with a foreign substance (especially organic contaminant), bonding may become defective. In this case, before the light emitting diode chip 1 is bonded to the bump 4 of the mounting substrate 2 by flip chip, the electrode of the light emitting diode chip 1 is cleaned by atmospheric pressure plasma. Thus, the electrode thereof can be made clean, and defective bonding with the bump 4 can be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT |
