| 摘要 |
The invention relates to a support ( 4 ) with solder ball elements ( 1 ) for loading substrates ( 2 ) with ball contacts. Furthermore, the invention relates to a system for loading substrates ( 2 ) with ball contacts and to a method for loading substrates ( 2 ) with ball contacts. For this purpose, the support ( 4 ) has a layer of adhesive ( 5 ) applied on one side, the layer of adhesive ( 5 ) losing its adhesive force to the greatest extent when irradiated. Furthermore, the support ( 4 ) has solder ball elements ( 1 ), which are arranged closely packed in rows ( 6 ) and columns ( 7 ) on the layer of adhesive ( 5 ) in a prescribed pitch (w) for a semiconductor chip or a semiconductor component.
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