发明名称 |
Flip-chip packaging process |
摘要 |
A flip-chip packaging process is disclosed. The present invention is featured in forming a copper pillar on a wafer, forming a solder on a substrate; and enabling the solder to substantially cover the entire externally-exposed surface of the copper pillar, thereby connecting the copper pillar to the substrate. The copper pillar of the present invention can be such as a prism or a cylinder. |
申请公布号 |
US2007052109(A1) |
申请公布日期 |
2007.03.08 |
申请号 |
US20050320786 |
申请日期 |
2005.12.30 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHEN CHIEN-FAN;CHEN YI-HSIN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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