发明名称 POLISHING PAD
摘要 <p>Disclosed is a polishing pad which is free from center-slow problems while having a good polishing rate and excellent life characteristics. Specifically disclosed is a polishing pad having a polishing layer which is made of a polyurethane resin foam having fine air bubbles. A high molecular weight polyol component as a raw material component for the polyurethane resin foam contains a hydrophobic high molecular weight polyol A having a number-average molecular weight of 550-800 and another hydrophobic high molecular weight polyol B having a number-average molecular weight of 950-1,300 at a weight ratio A/B of 10/90-50/50.</p>
申请公布号 WO2007026569(A1) 申请公布日期 2007.03.08
申请号 WO2006JP316372 申请日期 2006.08.22
申请人 TOYO TIRE & RUBBER CO., LTD.;OGAWA, KAZUYUKI;SHIMOMURA, TETSUO;NAKAI, YOSHIYUKI;NAKAMORI, MASAHIKO;YAMADA, TAKATOSHI 发明人 OGAWA, KAZUYUKI;SHIMOMURA, TETSUO;NAKAI, YOSHIYUKI;NAKAMORI, MASAHIKO;YAMADA, TAKATOSHI
分类号 B24B37/20;B24B37/24;C08G18/65;H01L21/304 主分类号 B24B37/20
代理机构 代理人
主权项
地址