摘要 |
<p>A radiation-sensitive resin composition that exhibits high sensitivity to active radiations of wide wavelength region, excelling in image resolution, etc.; a resin film formed using the composition; a transfer film having the resin film; and a process for producing a plating shaped item in which a thick plating shaped item, such as bump or wiring, can be produced with high accuracy with the use of the composition or transfer film. There is provided a negative radiation-sensitive resin composition characterized by containing alkali-soluble resin (A), compound having at least one ethylenically unsaturated double bond (B), radiation-sensitive radical polymerization initiator (C), compound having a specified anthracene structure (D) and organic solvent (E).</p> |
申请人 |
JSR CORPORATION;ONIMARU, NAMI;SAKAI, HIROKO;YOKOYAMA, KEN-ICHI;OHTA, MASARU;IWANAGA, SHIN-ICHIRO |
发明人 |
ONIMARU, NAMI;SAKAI, HIROKO;YOKOYAMA, KEN-ICHI;OHTA, MASARU;IWANAGA, SHIN-ICHIRO |