发明名称 RADIATION-SENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING PLATING SHAPED ITEM
摘要 <p>A radiation-sensitive resin composition that exhibits high sensitivity to active radiations of wide wavelength region, excelling in image resolution, etc.; a resin film formed using the composition; a transfer film having the resin film; and a process for producing a plating shaped item in which a thick plating shaped item, such as bump or wiring, can be produced with high accuracy with the use of the composition or transfer film. There is provided a negative radiation-sensitive resin composition characterized by containing alkali-soluble resin (A), compound having at least one ethylenically unsaturated double bond (B), radiation-sensitive radical polymerization initiator (C), compound having a specified anthracene structure (D) and organic solvent (E).</p>
申请公布号 WO2007026520(A1) 申请公布日期 2007.03.08
申请号 WO2006JP315771 申请日期 2006.08.09
申请人 JSR CORPORATION;ONIMARU, NAMI;SAKAI, HIROKO;YOKOYAMA, KEN-ICHI;OHTA, MASARU;IWANAGA, SHIN-ICHIRO 发明人 ONIMARU, NAMI;SAKAI, HIROKO;YOKOYAMA, KEN-ICHI;OHTA, MASARU;IWANAGA, SHIN-ICHIRO
分类号 G03F7/031;G03F7/004 主分类号 G03F7/031
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