COUPON FOR MEASURING FLATNESS OF SURFACE OF SUBSTRATE AND MEASURING METHOD THEREOF

摘要

A coupon for measuring a surface flatness of a substrate and a measuring method of the same are provided to measure the surface flatness of the substrate by using a nondestructive method. A coupon(10) is formed on a dummy part(5) of a printed circuit board including a circuit pattern in order to measure a surface flatness of the printed circuit board. A first pattern is formed on a center of the printed circuit board. The first pattern has a width wider than a width of the circuit pattern. A second pattern is formed at a predetermined position apart from the first pattern. The second pattern has a width corresponding to the width of the first pattern.