| 摘要 |
<P>PROBLEM TO BE SOLVED: To simplify a semiconductor module structure to reduce a manufacturing cost, and to simplify a structure of connecting a plurality of semiconductor cells in parallel and a structure of connecting a plurality of semiconductor cells of each group and a plurality of semiconductor cells of the adjacent group in series. <P>SOLUTION: A pair of sheet bodies 81 and 82 and a plurality of granular semiconductor cells 11 are provided between these sheet bodies. Each semiconductor cell has a pair of electrodes 16 and 17 connected to both ends of a p-n junction and has a function of light emission or light reception. In the plurality of semiconductor cells, a conductive direction connecting the pair of electrodes is arranged in a prescribed direction orthogonal to the pair of sheet bodies. A plurality of film-shaped conductive film members 84 to 86 that can be electrically connected to an electrode of the semiconductor cells of a plurality of groups are respectively formed on inner surfaces of the first and second sheet bodies. A mechanism of connecting the plurality of semiconductor cells of each group in parallel through the conductive film members is provided. A mechanism of connecting the plurality of semiconductor cells adjacent to the plurality of semiconductor cells of each group in series is provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
