Method for thinning substrate and method for manufacturing circuit device

摘要

The object of the present invention is to provide a method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate 1 and the substrate W are joined by using an adhesive layer 2 , and a sheet 6 is attached to the supporting plate 1 . The surface of the supporting plate 1 to which the sheet 6 has been attached is mounted and fixed by attraction onto an attracting head 7 . The surface of the semiconductor wafer W on which no circuit device is formed is ground by a grinder 8 in this state.