发明名称 |
Method for forming wiring on insulating resin layer |
摘要 |
The method for forming wiring includes: laminating a thermosetting resin film in a semi-cured state and a metallic foil in this order on an insulating substrate where base-layer wiring is formed, a mat surface of the metallic foil facing the resin film, pressing the film and the foil with application of heat; forming an opening in the metallic foil so as to expose a part of the insulating resin layer in which a via hole is to be formed; forming the via hole in the insulating resin layer by irradiating high-energy beams on to insulating resin layer by using as a mask the metallic foil in which the opening is formed; performing a desmear process of the via hole via the opening of the metallic foil; removing the metallic foil by etching; forming an electroless-plated layer that continuously covers the top surface of the insulating resin layer, a side surface of the via hole and a top surface of the base-layer wiring corresponding to the bottom of the via hole; and forming wiring including an electroplated layer on the electroless-plated layer by a semi-additive process.
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申请公布号 |
US2007051459(A1) |
申请公布日期 |
2007.03.08 |
申请号 |
US20060516737 |
申请日期 |
2006.09.07 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMANO TAKAHARU;HARAYAMA KOSAKU;KATO HIROYUKI;KOYAMA TETSUYA |
分类号 |
H05K3/46;B32B38/00;B32B38/04 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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