| 摘要 |
Wafer degassing equipment is provided to improve the yield by prevent the generation of cracks on a wafer due to the difference of temperature between the wafer and a wafer holder using a plurality of pins capable of spacing the wafer apart from the wafer holder. Wafer degassing equipment is used for removing residual moisture from a surface of a wafer. The degassing equipment includes a chamber, a heater for heating the wafer, a spin chuck for rotating the wafer at a lower portion of the chamber, and a wafer holder. The wafer holder(156) includes a protruded portion(155) for spacing the wafer apart from the spin chuck and a plurality of pins(158) for spacing the wafer apart from the wafer holder itself. The pin is made of a ceramic material.
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