发明名称 |
Method of producing a nitride semiconductor device and nitride semiconductor device |
摘要 |
<p>Al x In y Ga 1-x-y N (0‰¦x‰¦1; 0‰¦x‰¦1; 0‰¦x+y‰¦1) layered device chips are produced by the steps of preparing a defect position controlled substrate of Al x In y Ga 1-x-y N (0‰¦x‰¦1; 0‰¦y‰¦1; 0‰¦x+y‰¦ 1) having a closed loop network defect accumulating region H of slow speed growth and low defect density regions ZY of high speed growth enclosed by the closed loop network defect accumulating region H, growing epitaxial upper layers B selectively on the low defect density regions ZY, harmonizing outlines and insides of device chips composed of the upper layers B with the defect accumulating region H and the low defect density regions ZY respectively, forming upper electrodes on the upper layers B or not forming the electrodes, dissolving bottom parts of the upper layers B by laser irradiation or mechanical bombardment, and separating the upper layer parts B as device chips C from each other and from the substrate S. Chip-separation is done instantly by the high power laser irradiation or mechanical shock without cutting the substrate S. The defect position controlled substrate S is repeatedly reused.</p> |
申请公布号 |
EP1760767(A2) |
申请公布日期 |
2007.03.07 |
申请号 |
EP20060017373 |
申请日期 |
2006.08.21 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NAKAHATA, SEIJI;UEMATSU, KOJI;NAKAHATA, HIDEAKI |
分类号 |
H01L21/20;H01L21/02;H01L21/78;H01L33/00;H01L33/06;H01L33/32;H01L33/40 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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