发明名称 THERMOPLASTIC RESIN COMPOSITION AND MOLDING THEREOF
摘要 A thermoplastic resin composition and a molded product, having excellent transparency, ultraviolet absorptivity and light resistance, are provided. <??>A thermoplastic resin composition comprising from 0.001 to 10 wt%, based on the total resin composition, of a glass filler whose glass formulation consists mainly of a silicon oxide composition and exhibiting light transmittances at wavelengths of 340 nm and 400 nm of from 0 to 0.5% and from 30 to 99%, respectively, per mm of light path length. A molded product which is a molded product of a thermoplastic resin composition, characterized in that in a case where (1) an ultra-high pressure mercury lamp which does not substantially emit ultraviolet light having a wavelength of at most 250 nm, is used at such a distance that the intensity of ultraviolet light having a wavelength of 350 nm generated by the lamp would be 0.1 W/cm<2> on the surface of the molded product, and (2) the molded product is irradiated for 72 hours in the air at the surface temperature thereof being 60 DEG C, the light transmittance at a wavelength of 650 nm after the irradiation, is at least 70% per mm of light path length. <IMAGE>
申请公布号 EP1550699(A4) 申请公布日期 2007.03.07
申请号 EP20030751428 申请日期 2003.10.09
申请人 MITSUBISHI CHEMICAL CORPORATION 发明人 KAWA, MANABU
分类号 C08L101/00;G02B1/11;B32B5/16;B32B9/00;B32B27/36;C08K3/40;C08K5/3435;C08K7/14;G02B1/04 主分类号 C08L101/00
代理机构 代理人
主权项
地址