发明名称 Polishing method
摘要 <p>A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.</p>
申请公布号 EP1760127(A2) 申请公布日期 2007.03.07
申请号 EP20060020541 申请日期 1998.10.30
申请人 HITACHI, LTD. 发明人 HOMMA, YOSHIO;SAKUMA, NORIYUKI;TAKEDA, KENICHI;HINODE, KENJI
分类号 C09G1/02;B24B37/00;B24B37/04;C09K3/14;H01L21/02;H01L21/304;H01L21/321 主分类号 C09G1/02
代理机构 代理人
主权项
地址